High-density BNC with pick-and-place capability

Samtec offers a 75-Ohm High-Density BNC solution (HDBNC Series) with an exclusive, balanced right-angle design excellent for high volume pick-and-place manufacturing (-BM1D and -BM2D die-cast options).

Designed principally for advanced broadcast video equipment usage, the new series was tested to the latest SMPTE 2082 12G-SDI pass/fail specifications, with return loss measurements exceeding minimum needs by a least -10dB from 0-12GHz. Results also show remarkably low VSWR and insertion loss.

Product design was optimised and offers an increased surface area to deliver proper vacuum sealing, while weight modifications assure balance through pick-and-place onto the PCB. The die-cast products maintain a compact design for increased panel density with 8mm (0.315″) body height and 8.5mm (0.335″) width. Body height matches current screw-machined right-angle designs for more effortless adaptability to existing applications.

The company provides a wide assortment of solutions supporting broadcast video systems, and its RF/Signal Integrity engineers are available for application-specific product design, 75-Ohm signal integrity support, or custom board launch design services.

Related Posts